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V048K096T025 (Vicor Corporation) : Total 15 Pages

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VTM
PRELIMINARY
V•I ChipTM – VTM
Voltage Transformation Module
• 48 V to 9.6 V V•I Chip Converter
• 25.0 A (37.5 A for 1 ms)
• High density – 974 W/in3
• Small footprint – 220 W/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
• 1 µs transient response
• 3.5 million hours MTBF
• Typical efficiency 96%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K096T025
K indicates BGA configuration. For other
mounting options see Part Numbering below.
©
Vf = 26 - 55 V
VOUT = 5.20 - 11.0 V
IOUT = 25.0 A
K = 1/5
ROUT = 10.0 mmax
Actual size
Product Description
The V048K096T025 V•I Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced DSP, FPGA, and ASIC at
the point of load (POL) while providing isolation from
input to output. It achieves a response time of less than
1 µs and delivers up to 25.0 A in a volume of less than
0.25 in3 with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 5.20 to 11.0 Vdc.
The VTM V048K096T025’s nominal output voltage is
9.6 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 5.20 to 11.0 Vdc at no load, and from
4.95 to 10.8 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/5 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 9.6 V VTM achieves a power density of 974 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing the POL density while improving reliability and
decreasing cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature(1)
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 16.0
2,250
25.0
37.5
270
405
208
-40 to 125
-55 to 125
Storage temperature
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
096
Output Voltage
Designator
(=VOUT x10)
T
025
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
M -65 to150 -55 to125
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 1 of 15



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Electrical Specifications
PRELIMINARY
V•I Chip Voltage Transformation Module
Input Specs (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input overvoltage turn-on
Input overvoltage turn-off
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Min Typ Max Unit
Note
26 48 55 Vdc Operable down to zero V with VC voltage applied
1 V/µs
55.0 Vdc
59.5 Vdc
5.4 Adc
140
mA p-p
Using test circuit in Figure 16; See Figure 1
3.1 4.1
W
4.0 µF
20 nH
Output Specs (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Output voltage
Rated DC current
Peak repetitive current
Short circuit protection set point
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
10 µF bypass capacitor
Effective switching frequency
Line regulation
K
Load regulation
ROUT
Transient response
Voltage overshoot
Response time
Recovery time
Min Typ Max Unit
5.20 11.0 Vdc
4.95 10.8 Vdc
0 25.0 Adc
37.5 A
25.5 30.5 35.0
5 10
Adc
%
95.5 96.2
95.5 96.2
1.6
55.0
11.0
%
%
nH
µF
Vdc
176 200
mV
17.4 mV
3.0 3.1 3.4 MHz
0.1980
1/5 0.2020
8.9 10.0 m
90 mV
200 ns
1 µs
Note
No load
Full load
26 - 55 VIN
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
Module will shut down
See Parallel Operation on Page 10
See Figure 3
See Figure 3
Effective value
Module will shut down
See Figures 2 and 5
See Figure 6
Fixed, 1.6 MHz per phase
VOUT = K•VIN at no load
See Figure 19
25.0 A load step with 100 µF CIN; See Figures 7 and 8
See Figures 7 and 8
See Figures 7 and 8
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 2 of 15



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Electrical Specifications (continued)
PRELIMINARY
Waveforms
Figure 1— Input reflected ripple current at full load and 48 Vf.
Ripple vs. Output Current
180
160
140
120
100
80
60
40
20
0
0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25
Output Current (A)
Figure 2— Output voltage ripple vs. output current at 9.6 Vout with no
POL bypass capacitance.
Efficiency vs. Output Current
97
96
95
94
93
92
91
90
89
88
87
0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25
Output Current (A)
Figure 3— Efficiency vs. output current at 48 Vf.
Power Dissipation
10
9
8
7
6
5
4
3
2
1
0
0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25
Output Current (A)
Figure 4—Power dissipation as a function of output current at 48 Vf.
Figure 5— Output voltage ripple at full load and 9.6 Vout; without any
external bypass capacitor.
Figure 6—Output voltage ripple at full load and 9.6 Vout with 10 µF
ceramic external bypass capacitance and 20 nH distribution inductance.
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 3 of 15



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Electrical Specifications (continued)
PRELIMINARY
V•I Chip Voltage Transformation Module
Figure 7— 0-25.0 A step load change with 47 µF input capacitance and no
output capacitance.
Figure 8— 25.0-0 A step load change with 47 µF input capacitance and no
output capacitance.
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions(BGA version)
Length
Width
Height
Min Typ Max
3.5
2,250
10
3,000
cTÜVus
CE Mark
0.5 / 14.0
1.26 / 32
0.85 / 21.5
0.23 / 5.9
Unit
Mhrs
Vdc
pF
M
oz / g
in / mm
in / mm
in / mm
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low voltage directive
See Mechanical Drawing, Figures 10 and 12
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Disable delay time
VTM Control (VC)
External boost voltage
External boost duration
Min Typ Max Unit
4.8 5.0 5.2 Vdc
2.4 2.5
Vdc
2.5 2.6 Vdc
2.4 2.5 2.9 mA
10 µs
12.0 14.0 19.0
10
Vdc
ms
Note
VC voltage must be applied when module is enabled using PC
Source only
PC low to Vout low
Required for VTM start up without PRM
Vin > 26 Vdc. VC must be applied continuously
if Vin < 26 Vdc.
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 4 of 15






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