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L-4863 (Unisonic Technologies) : Total 10 Pages

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UNISONIC TECHNOLOGIES CO., LTD
L4863
DUAL 2.2W AUDIO AMPLIFIER
PLUS STEREO HEADPHONE
FUNCTION
SOP-16
CMOS IC
SOP-18
DESCRIPTION
The UTC L4863 is a dual bridge-connected audio power
amplifier. It combines dual bridge speaker amplifiers and stereo
headphone amplifiers on one chip to simplify audio system design.
In addition, the headphone input pin allows the amplifiers to
operate in single-ended mode when driving stereo headphones.
The IC could deliver different power by packages as below (when
connected to a 5V supply with less than 1.0% THD+N.):
- HTSSOP-20, 4load: 2.2W
- HTSSOP-20, 3load: 2.5W(with forced-air cooled)
- SOP/DIP , 8load: 1.1W.
The UTC L4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier mode,
and thermal shutdown protection. It also utilizes circuitry to reduce
“clicks and pops” during device turn-on.
FEATURES
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* “Click and pop” suppression
* Thermal shutdown protection
* Unity-gain stable
* Stereo headphone amplifier mode
DIP-16
HTSSOP -20
*Pb-free plating product number: L4863L
DataShee
ORDERING INFORMATION
Order Number
Normal
Lead Free Plating
Package
L4863-D16-T
L4863L-D16-T
DIP-16
L4863-S16-R
L4863L-S16-R
SOP-16
L4863-S16-T
L4863L-S16-T
SOP-16
L4863-S18-R
L4863L-S18-R
SOP-18
L4863-S18-T
L4863L-S18-T
SOP-18
L4863-N20-R L4863L-N20-R HTSSOP-20
L4863-N20-T
L4863L-N20-T HTSSOP-20
Packing
Tube
Tape Reel
Tube
Tape Reel
Tube
Tape Reel
Tube
LM4863L-D16-T
(1)Packing Type
(2)Package Type
(3)Lead Plating
(1) R: Tape Reel, T: Tube
(2) D16: DIP-16, S16: SOP-16, S18: SOP-18,
N 20: HTSSOP-20
(3) L: Lead Free Plating, Blank: Pb/Sn
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Copyright © 2005 Unisonic Technologies Co., Ltd
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L4863
PIN CONFIGURATION
CMOS IC
SHUTDOWN
GND
+OUT A
VDD
-OUT A
-IN A
GND
+IN A
1
2
3
4
5
6
7
8
DIP-16
SOP-16
16 HP-IN
15 GND
14 +OUT B
13 VDD
12 -OUT B
11 -IN B
10 BYPASS
9 +IN B
SHUTDOWN
GND
+OUT A
VDD
-OUT A
-IN A
GND
+IN A
GND
1
2
3
4
5
6
7
8
9
SOP-18
18 HP-IN
17 GND
16 +OUT B
15 VDD
14 -OUT B
13 -IN B
12 BYPASS
11 +IN B
10 GND
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HTSSOP-20
SHUTDOWN 1
GND 2
+OUT A 3
VDD 4
-OUT A 5
-IN A 6
GND 7
+IN A 8
GND 9
GND 10
20 HP-IN
19 GND
18 +OUT B
17 VDD
16 -OUT B DataSheet4U.com
15 -IN B
14 BYPASS
13 +IN B
12 GND
11 GND
THERMAL DATA
PARAMETER
Thermal resistance (Junction to Ambient)
Thermal resistance (Junction to Case)
SYMBOL
SOP-16
SOP-18
DIP-16
θJA
HTSSOP-20
SOP-16
SOP-18
DIP-16
θJC
HTSSOP-20
RATINGS
80
90
63
90
20
2
20
2
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UNIT
/W
/W
/W
/W
/W
/W
/W
/W
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L4863
CMOS IC
ABSOLUTE MAXIMUM RATING
PARAMETER
SYMBOL
RATINGS
UNIT
Supply Voltage
VDD 6.0
V
Recommended Supply Voltage Range
Input Voltage
VDD 2.0 ~ 5.5
VIN -0.3 ~ VDD+0.3
V
V
Power Dissipation
Junction Temperature
PD Internally limited
TJ +125
Operating Temperature
TOPR
-40 ~ +85
Storage Temperature
TSTG
-65 ~ +150
Note Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
ELECTRICAL CHARACTERISTICS (Notes 1)(VDD=5V, Ta =25, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIM TYP MAX UNIT
FOR ENTIRE IC
Supply Voltage
Quiescent Power Supply Current
(Note 2)
VDD
IDD
Shutdown Current
Headphone Input Voltage
High
Low
ISD
VIH
VIL
FOR BRIDGED-MODE OPERATION
VIN=0V, IOUT=0A, HP-IN=0V
VIN=0V, IOUT=0A, HP-IN=4V
VDD applied to the SHUTDOWN pin
2 5.5 V
6
11.5 20
5.8
mA
2 0.7
µA
4V
0.8 V
Output Offset Voltage
Output Power
HTSSOP-20
(measured at the device
terminals)
SOP/DIP
VO(OFF) VIN=0V
THD=1%, f=1kHz
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POUT THD+N=10%, f=1kHz
RL=3
RL=4
RL=3
RL=4
THD=1%, f=1kHz
RL=8
THD+N=10%, f=1kHz
RL=8
THD+N=1%, f=1kHz, RL=32
5 50
2.5
2.2
3.2
2.7
1.0 1.1
1.5
0.34
mV
W
W
W
Total
Harmonic HTSSOP-20
Distortion + Noise
SOP/DIP
THD+N
20Hzf20kHz,
AVD=2
RL=4, POUT=2W
RL=8, POUT=1W
0.3
0.3
%
Power Supply Rejection Ratio
PSRR
VDD=5V, VRIPPLE=200mVRMS, RL=8,
CB=1.0µF
67 dB
Channel Separation
XTALK f=1kHz, CB=1.0µF
90 dB
Signal To Noise Ratio
SNR VDD=5V, POUT=1.1W, RL=8
98 dB
FOR SINGLE-ENDED OPERATION
Output Offset Voltage
VO(OFF) VIN=0V
5 50 mV
Output Power
THD=0.5%, f=1kHz, RL=32
POUT THD+N=1%, f=1kHz, RL=8
75 85
340
mW
THD+N=10%, f=1kHz, RL=8
440
Total Harmonic Distortion + Noise
THD+N
AV=-1, POUT=75mW,20Hzf20kHz,
RL=32
0.2 %
Power Supply Rejection Ratio
PSRR CB=1.0µF, VRIPPLE=200mVRMS, f=1kHz
52 dB
Channel Separation
XTALK f=1kHz, CB=1.0µF
60 dB
Signal To Noise Ratio
SNR VDD=5V, POUT=340mW, RL=8
95
Note:1. All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
dB
2. Depends on the offset voltage when a practical load is connected to the amplifier.
3. When driving 3or 4and operating on a 5V supply, the HTSSOP-20 package must be mounted to the
circuit board that has a minimum of 2.5 in2 of exposed, uninterrupted copper area connected to the
exposed-DAP.
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L4863
CMOS IC
TYPICAL APPLICATION CIRCUIT
Audio
Input
CI RF
1µF 20KΩ 6
RI 8
20KΩ
VDD
+
CS
0.1µF
4,13
TANT
- IN A
+IN A
+-AMP 1A
20KΩ
50KΩ
CB 10 Bypass VDD/2
Audio
Input
CI
1µF
(CB size)
0.33µF
RI
20KΩ
VDD
RF
11 -IN B
9 +IN B
50KΩ
+-AMP210KBΩ
20KΩ
100kΩ
To Control Pin on
Headphone jack 100KΩ
1
16
Shutdown
HP-IN
CO
-OUT A 5
20KΩ
100µF
+ CONTROL PIN
RL 1kΩ
RING
+-AMP202AK+OΩUT A
3
8Ω
To HP-IN Circuit
CO
-OUT B 12
100µF
+
TIP SLEEVE
HEADPHONE JACK
20KΩ
20KΩ
+-AMP
2B
+OUT
B
14
RL
8Ω
1kΩ
GND 2,7,15
Note: Pin out shown for DIP-16 and SOP-16 packages. Refer to the PIN CONFIGURATION for the pin out of other
packages.
Figure 1.Typical Audio Amplifier Application Circuit
EXTERNAL COMPONENTS DESCRIPTION
Components
RI
CI
RF
CS
CB
Functional Description
The inverting input resistance, DalaontagSwhiteheRt4FU, s.ectotmhe closed-loop gain. RI, along with CI form a high
pass filter with fc=1/(2πRICI)
The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. CI, along with RI,
create a high pass filter with fc=1/(2πRICI). Refer to the section. Selecting Proper External
Components, for an explanation of determine the value of CI.
The feedback resistance, along with RI, set the closed-Ioop gain.
The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about
properly placing and selecting the value of, this capacitor.
The capacitor, CB, filters the half-supply voltage present on the Bypass pin. Refer to the Selecting
Proper External Components section for information concerning proper placement and selecting
CB’S value.
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